Six Figure Work

Staff Program Manager - Advanced Packaging Technology

Broadcom

Company websitebroadcom.com (Broadcom, opens in new tab)

Base salary $109,700  to $175,500

Employer-published annual base salary, USD. Advertised base range in United States

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  • LocationUnited States
  • WorkplaceWorkplace not stated
  • Status at last checkSource accepting applications when checked
  • Last checked (57 min ago) · observed since

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Job Description:

Staff Program Manager – Advanced Packaging Technology 

Overview
The Staff Program Manager will manage one or more very large scale Advanced Packaging manufacturing projects, through the entire lifecycle from greenfield factory construction, to tool procurement, and all the way to production ramp. Extensive collaboration is required with all stakeholders (R&D and Factory Teams, internal Project Team members & executives, Partners, EPC Contractor and Tool Vendors worldwide) to achieve all project milestones on schedule and within budget, with proven yield and quality in production


Key Responsibilities
Technology Development and Transfer for Production
•    Achieve on time Technology Qualification, through collaborate with in-house and partner R&D teams developing disruptive technologies.
•    Facilitate successful Technology Transfer from R&D into High Volume Manufacturing (HVM)
Factory Construction 
•    Coordinate greenfield construction of a very large scale advanced packaging manufacturing facility
•    Manage the EPC contractor and other local architectural, engineering, and sub- contractor firms to ensure strict timeline and safety compliance.
•    Oversee compliance with local codes / requirements for land development, civil engineering, cleanroom construction, and facility hook-up.
•    Report program status, budget variances, and milestone achievements directly to executive leadership.
Tool Procurement & Integration
•    Work with Factory and R&D Teams on Tool selection, procurement, logistics, and installation of next generation equipment for Heterogeneous Integration from global tier-one vendors
•    Coordinate complex international logistics to import highly sensitive tooling and materials
•    Oversee the hook-up, facility integration, and initial hardware qualification of all manufacturing lines. 
Production Ramp & Yield Optimization
•    Partner with Factory & R&D teams and Tool vendors, for operational transition from tool qualification to HVM readiness
•    Accelerate yield learning curves and meet target defect-density metrics in collaboration with process engineering and quality teams
•    Manage manufacturing cycle time, line balancing, and factory automation deployment during the ramp phase.
•    Establish standard operating procedures (SOPs) and training pipelines to upscale the local workforce for stable production.
Financial & Local Regulatory Compliance
•    Manage multi-billion-dollar CapEx and OpEx budgets and cash flows, in collaboration with Finance teams.
•    Ensure compliance with local Regulatory Agency requirements
•    Implement strict risk-mitigation frameworks to handle supply chain bottlenecks and labor market constraints.

Required Qualifications
Education & Experience
•    Education: Master’s degree in Engineering, Materials Science, or related STEM field. MBA preferred.
•    Experience: 6+ years managing very large projects, with explicit experience in greenfield factory construction and factory ramps.
•    Domain: Deep technical understanding of advanced packaging and semiconductor manufacturing technologies (Heterogeneous Integration, Substrates, Co-packaged Optics).
•    Ramp Expertise: Proven track record transitioning a semiconductor facility from construction to high-volume production.
•    Geography: Foundational knowledge of delivering large-scale offshore industrial projects


Skills & Certifications
•    Certifications: PMP, PgMP, or equivalent senior-level project management credentials.
•    Operations: Strong grasp of factory physics, statistical process control (SPC), yield management, and Lean manufacturing.
•    Supply Chain: Expertise in managing global semiconductor tool and material vendors.
•    Software: Advanced mastery of enterprise scheduling tools (e.g., Primavera P6, MS Project).
•    Soft Skills: Exceptional stakeholder management skills for navigating dynamically changing business and product requirements 
 

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $109,700 - $175,500

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Source: Broadcom on Workday · View original posting (opens in new tab)

This range next to 6 other live Broadcom roles with the nearest advertised base floor
Chart as a table
This range next to 6 other live Broadcom roles with the nearest advertised base floor
RolePublished base
Staff Program Manager - Advanced Packaging Technology (this listing)$109,700 - $175,500
AI Software Engineer$109,700 - $175,500
Senior Digital / Mixed-Signal IC Design or Verification Engineer$109,700 - $175,500
DSP System Architect$109,700 - $175,500
Staff IC Verification Engineer$109,700 - $175,500
Reliability Engineer$109,700 - $175,500
Mainframe Software Development Engineer in Test$109,700 - $175,500

Same $100K to $400K scale as every card. All Broadcom roles · How to read the bar

Observed changes

  1. First observed on the employer's board
  2. Began meeting the published-salary criteria
Observed since
Employer-stated posting date
2026-06-15
Where this pay comes from

Location as the employer wrote it: USA-CA Irvine Alton Parkway Bldg 2

The annual base salary range for this position is $109,700 - $175,500

Method
Employer text, read with fixed rules and re-verified
Checked
Rule set
us-base-v2

The pay passage appears in the employer's own job text. Fixed, deterministic rules located it, and the passage below was checked against the stored copy of the posting.

What we verified

  • The pay figures come from the employer's own listing, quoted exactly above.
  • The pay is an annual base salary in US dollars with a minimum of at least $100,000.
  • The role was publicly listed on the employer's job board when last checked.

We do not verify what the employer will actually offer, whether the employer is still recruiting for the role, or anything beyond what the employer published. Full methodology.