Advanced Packaging Substrate Supplier Enablement Lead
Company websiteintel.com (Intel, opens in new tab)
Base salary From $164,100
Employer-published annual base salary, USD. Advertised base range in Chandler, AZ
You apply on the employer's own site. Six Figure Work does not handle applications.
- LocationChandler, AZ
- WorkplaceWorkplace not stated
- Status at last checkSource accepting applications when checked
- Last checked (1 h ago) · observed since
About this job
Job Details:
Job Description:
The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate Technology and Manufacturing Group, you will play a critical role in enabling new manufacturing capacity across advanced packaging suppliers.
In this position, you will lead substrate supplier development and qualification activities for advanced technologies such as high density FCBGA, EMIB-T and glass core substrate, ensuring suppliers achieve the required readiness to support growing customer demand. This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams and supplier partners. A combination of detail-oriented project management, strong technical risk assessment / problem solving skills, and effective supplier / stakeholder management will be needed to be successful.
Please note: This role requires periodic evening meetings with suppliers in East Asia, as well as occasional travel to supplier sites to support essential program objectives.
Key Responsibilities
- Define process integration roadmaps and establish manufacturing procedures to meet technology transfer milestones.
- Extract insights from structured and unstructured data, applying statistical analysis and coding techniques for yield improvement.
- Lead low yield analysis and corrective actions to address quality excursions in high-volume production environments.
- Drive continuous improvement initiatives to minimize defects and optimize process reliability.
- Assess quality and reliability risks for manufacturing material and process changes, ensuring sustained product performance.
- Collaborate with internal teams and external stakeholders to align process strategies with program goals.
Behavioral traits
- Demonstrated expertise in structured problem solving and data-driven decision-making.
- Proven leadership in supplier management and technology enablement.
- Strong collaboration, influencing, and communication skills across global, cross-functional teams.
- Strategic mindset with the ability to align technical solutions with organizational objectives.
- Enthusiasm for innovation, mentoring, and contributing to Intel's technical leadership.
Qualifications:
Minimum Qualifications
- Bachelor's degree in engineering, physics, materials science, or a related field, with 9+ years of relevant experience; or
- Master's degree in engineering, physics, materials science, or a related field, with 6+ years of relevant experience; or
- PhD in engineering, physics, materials science, or a related field, with 4+ years of relevant experience.
- The experience listed above should be a combination of the following:
- Proficiency in process integration methodologies and tools used in semiconductor manufacturing environments.
- Experience in advanced packaging, substrates, or semiconductor process development.
Join us in shaping the future of manufacturing with your expertise and passion for technology development.
Job Type:
Experienced HireShift:
Shift 1 (United States of America)Primary Location:
US, Arizona, PhoenixAdditional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust
N/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $164,100.00-231,670.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Source: Intel on Workday · View original posting (opens in new tab)
Pay in context
This role's base floor ($164,100) is above 77% of the 1,002 Manufacturing & Production roles nationwide listed on this site. Their median floor is $140,000; the middle half runs from $120,000 to $160,000.
Only jobs on this site count, and each one publishes a base salary of $100,000 or more, so this compares six-figure jobs with each other, not with the whole market. Computed Nov 7, 2026.
This listingAdvanced Packaging Substrate Supplier Enablement LeadFrom $164,100
Senior SiPh Product Development EngineerFrom $164,470
Thermal Analysis EngineerFrom $164,470
Memory Circuit Design EngineerFrom $164,470
Senior CPU RTL Design EngineerFrom $164,470
Platform Hardware Design EngineerFrom $164,470
Photonic System Design EngineerFrom $164,470
Chart as a table
| Role | Published base |
|---|---|
| Advanced Packaging Substrate Supplier Enablement Lead (this listing) | From $164,100 |
| Senior SiPh Product Development Engineer | From $164,470 |
| Thermal Analysis Engineer | From $164,470 |
| Memory Circuit Design Engineer | From $164,470 |
| Senior CPU RTL Design Engineer | From $164,470 |
| Platform Hardware Design Engineer | From $164,470 |
| Photonic System Design Engineer | From $164,470 |
Observed changes
- First observed on the employer's board
- Began meeting the published-salary criteria
- Observed since
- Employer-stated posting date
- 2026-09-22
Where this pay comes from
Location as the employer wrote it: US, Arizona, Phoenix
Annual Salary Range for jobs which could be performed in the US: $164,100.00-231,670.00 USD
- Method
- Employer text, read with fixed rules and re-verified
- Checked
- Rule set
- us-base-v2
The pay passage appears in the employer's own job text. Fixed, deterministic rules located it, and the passage below was checked against the stored copy of the posting.
What we verified
- The pay figures come from the employer's own listing, quoted exactly above.
- The pay is an annual base salary in US dollars with a minimum of at least $100,000.
- The role was publicly listed on the employer's job board when last checked.
We do not verify what the employer will actually offer, whether the employer is still recruiting for the role, or anything beyond what the employer published. Full methodology.
