Module Engineer PhD Intern New 2027
Company websiteintel.com (Intel, opens in new tab)
Base salary From $120,898
Employer-published annual base salary, USD. Advertised base range in Hillsboro, OR
You apply on the employer's own site. Six Figure Work does not handle applications.
- LocationHillsboro, OR
- WorkplaceWorkplace not stated
- Status at last checkSource accepting applications when checked
- Last checked (2 h ago) · observed since
About this job
Job Details:
Job Description:
The Role and Impact
As a Module Engineering PhD Intern, you will actively contribute to the development and optimization of manufacturing processes for a specific module in semiconductor production. Your daily activities will include sustaining and improving manufacturing equipment performance, assisting in troubleshooting issues, and supporting qualification efforts. This hands-on internship offers an exciting opportunity to apply your academic knowledge, gain practical skills, and explore future career possibilities in a dynamic and innovation-driven environment.
Business group
Intel Foundry is dedicated to advancing semiconductor manufacturing technologies and delivering cutting-edge solutions to meet customer needs worldwide. As part of this organization, you will join a team focused on optimizing manufacturing processes and sustaining high-performance equipment, contributing to Intel's broader mission of driving technological excellence and innovation in semiconductor production.
Key Responsibilities
- Support the development and optimization of semiconductor manufacturing processes for a specific module.
- Sustain and improve manufacturing equipment performance to ensure operational efficiency and reliability.
- Assist in equipment troubleshooting, maintenance, and qualification activities to meet production standards.
- Collaborate with engineering teams to enhance process control methodologies and achieve production goals.
- Apply statistical analysis and experimental design techniques to improve process reliability and throughput.
- Gain hands-on experience with materials and device characterization techniques, such as SEM and TEM.
- Contribute to continuous improvement initiatives for process control systems and methodologies.
Qualifications:
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences.
Minimum Qualifications
-Currently pursuing a PhD degree in Physics, Chemical Engineering, Materials Science, Electrical Engineering, or a semiconductor related STEM field.
-Experience in Plasma etch (ICP/RIE/ALED/DRIE/CCP), cleanroom and fabrication experience and process development and optimization.
-Experience in materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, SIMS.
-Knowledge in Large data statistical analysis or Machine Learning with focus on process optimizations, APC and variability reduction.
Preferred Qualifications
-Understanding of JMP, Python, or MATLAB to drive data-based decisions in process optimization and matching.
-Prior internship at semiconductor manufacturing and foundry companies or equipment suppliers.
-GPA 3.0 or higher.
If you're ready to advance your expertise in semiconductor manufacturing, collaborate in a supportive environment, and contribute to innovative solutions that shape the future of technology, we encourage you to apply today.
Job Type:
Student / InternShift:
Shift 1 (United States of America)Primary Location:
US, Oregon, HillsboroAdditional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust
N/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $120,898.00-120,902.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Source: Intel on Workday · View original posting (opens in new tab)
This listingModule Engineer PhD Intern New 2027From $120,898
EHS EngineerFrom $120,860
Module EngineerFrom $120,860
Process Integration Development EngineerFrom $120,860
Global Construction EHS EngineerFrom $120,860
Quality And Reliability EngineerFrom $120,860
New Mexico Wafer Packaging Manufacturing Advanced Packaging Die Pick Engineering Group LeaderFrom $120,860
Chart as a table
| Role | Published base |
|---|---|
| Module Engineer PhD Intern New 2027 (this listing) | From $120,898 |
| EHS Engineer | From $120,860 |
| Module Engineer | From $120,860 |
| Process Integration Development Engineer | From $120,860 |
| Global Construction EHS Engineer | From $120,860 |
| Quality And Reliability Engineer | From $120,860 |
| New Mexico Wafer Packaging Manufacturing Advanced Packaging Die Pick Engineering Group Leader | From $120,860 |
Observed changes
- First observed on the employer's board
- Began meeting the published-salary criteria
- Observed since
- Employer-stated posting date
- 2026-10-14
Where this pay comes from
Location as the employer wrote it: US, Oregon, Hillsboro
Annual Salary Range for jobs which could be performed in the US: $120,898.00-120,902.00 USD
- Method
- Employer text, read with fixed rules and re-verified
- Checked
- Rule set
- us-base-v2
The pay passage appears in the employer's own job text. Fixed, deterministic rules located it, and the passage below was checked against the stored copy of the posting.
What we verified
- The pay figures come from the employer's own listing, quoted exactly above.
- The pay is an annual base salary in US dollars with a minimum of at least $100,000.
- The role was publicly listed on the employer's job board when last checked.
We do not verify what the employer will actually offer, whether the employer is still recruiting for the role, or anything beyond what the employer published. Full methodology.
