Six Figure Work

Module Engineering PhD Intern New 2027

Intel

Company websiteintel.com (Intel, opens in new tab)

Base salary From $120,898

Employer-published annual base salary, USD. Advertised base range in Hillsboro, OR

Apply (opens in new tab)

You apply on the employer's own site. Six Figure Work does not handle applications.

  • LocationHillsboro, OR
  • WorkplaceWorkplace not stated
  • Status at last checkSource accepting applications when checked
  • Last checked (1 h ago) · observed since

About this job

Job Details:

Job Description: 

As one of the world's largest chip manufacturers, and a global leader in innovative technology, Intel strives to make every facet of semiconductor manufacturing state-of-the-art from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world-class Supply Chain and facilities support.

Join us at Intel Foundry Logic Technology Development (LTD) for a Graduate internship and participate in creating the next generation of technologies that will shape the future for decades to come. LTD intern would conduct scientific research to enable manufacturing of innovative device architectures. They would engage in designing, executing and analyzing experiments necessary to meet engineering specifications for their process, and participate in process and equipment development.

The Role and Impact


In this role, you will contribute to module process development, process integration flows, and equipment configuration for manufacturing modules.  Work may also include support for yield improvement initiatives by analyzing defect data, conducting experiments, and assisting in risk assessments. You will work in collaboration with engineering teams to optimize metrology strategies, troubleshoot process flow issues, and continuously improve the process in preparation for high-volume manufacturing environment. As an intern, you will have an opportunity to learn and apply your knowledge, build skills, and explore future career opportunities through hands-on experience and projects that support Intel business goals in a collaborative environment.

Business group


As part of Intel Foundry, you will join Logic Technology Development (LTD) Metals team that focuses on Metals Thin Films Deposition within semiconductor manufacturing. The Logic Technology Development (LTD) organization delivers the latest process technology innovations to drive Intel's product roadmap. We foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. The team supports Intel's broader mission of driving innovation and delivering high-quality solutions to meet global technological demands.

Key Responsibilities

  • Contribute to process development, continuous improvement, and implementation of semiconductor manufacturing processes for a specific module within LTD Metals.to help develop and improve our processes

  • Design, execute, analyze experiments and present conclusions and recommendations to the group

  • Collaborate with fab technicians and support experiment execution with clear instructions

  • Assist engineering teams in process flow troubleshooting and metrology optimization strategies

  • Apply statistical analysis and design experiments to enhance process reliability and throughput.

  • Gain experience in materials and device characterization techniques, such as ellipsometry, xray-based techniques, 4-point probe, AFM, SEM and TEM.

Qualifications:

Minimum Qualifications

  • PhD student in Chemical Engineering, Electrical Engineering, Material Science, Physics, Chemistry, Mechanical Engineering, or a related field of study.

  • Knowledge of semiconductor processing fundamentals, including thin films deposition, lithography, etching, polishing.

  • Experience in thin films materials deposition techniques (ALD, CVD, PVD or electroplating) and characterization (ellipsometry, XRF, XPS, XRR, 4-point probe, AFM, SEM, TEM, etc.), hands-on lab/fab equipment experience

  • Data analysis skills with demonstrated ability to construct clear data-based problem statements, design of experiment


Preferred Qualifications

  • PhD student 3rd or 4th year; experience with thin film deposition and characterization


If you're eager to advance your expertise in semiconductor technology, collaborate in a supportive environment, and contribute to innovative solutions that shape the future of manufacturing, we encourage you to consider this opportunity.

Job Type:

Student / Intern

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Oregon, Hillsboro

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $120,898.00-120,902.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Source: Intel on Workday · View original posting (opens in new tab)

This range next to 6 other live Intel roles with the nearest advertised base floor
Chart as a table
This range next to 6 other live Intel roles with the nearest advertised base floor
RolePublished base
Module Engineering PhD Intern New 2027 (this listing)From $120,898
Module Engineering - PhD Intern (Wet Etch)From $120,898
Module Development Engineer PhD Intern New 2027From $120,898
Module Engineering PhD InternFrom $120,898
Process Integration and Yield Eng PhD Intern, 2027From $120,898
Module Engineering PhD Intern New 2027From $120,898
Module Engineering - PhD Intern (Advanced Wet Etch and Cleans)From $120,898

Same $100K to $400K scale as every card. All Intel roles · How to read the bar

Observed changes

  1. First observed on the employer's board
  2. Began meeting the published-salary criteria
Observed since
Employer-stated posting date
2026-09-11
Where this pay comes from

Location as the employer wrote it: US, Oregon, Hillsboro

Annual Salary Range for jobs which could be performed in the US: $120,898.00-120,902.00 USD

Method
Employer text, read with fixed rules and re-verified
Checked
Rule set
us-base-v2

The pay passage appears in the employer's own job text. Fixed, deterministic rules located it, and the passage below was checked against the stored copy of the posting.

What we verified

  • The pay figures come from the employer's own listing, quoted exactly above.
  • The pay is an annual base salary in US dollars with a minimum of at least $100,000.
  • The role was publicly listed on the employer's job board when last checked.

We do not verify what the employer will actually offer, whether the employer is still recruiting for the role, or anything beyond what the employer published. Full methodology.