NM Wafer Packaging Manufacturing Advanced Packaging Engineer
Company websiteintel.com (Intel, opens in new tab)
Base salary From $103,730
Employer-published annual base salary, USD. Advertised base range in Rio Rancho, NM
You apply on the employer's own site. Six Figure Work does not handle applications.
- LocationRio Rancho, NM
- WorkplaceWorkplace not stated
- Status at last checkSource accepting applications when checked
- Last checked (44 min ago) · observed since
About this job
Job Details:
Job Description:
The Role and Impact
Note: This position requires regular onsite presence to perform essential job responsibilities.
New Mexico Wafer Packaging Manufacturing (NMWPM) is expanding, and we are seeking Module Engineers specializing in Wafer-Level Assembly, Die Preparation, and Metrology. These roles will support both high-volume manufacturing (HVM) and technology development activities, including process transfers and product start-ups for Foveros, Embedded Bridge, and Intel Foundry Services (IFS) technologies.
Key Responsibilities
Responsibilities include, but are not limited to:
- Drive sustained operational excellence by proactively identifying and implementing safety and ergonomic improvements, excursion prevention measures, and initiatives that enhance equipment availability, utilization, and cost efficiency.
- Collaborate with partner factories to transfer new processes, maintain Copy Exactly standards, share best practices, and drive continuous improvements in processes and equipment performance.
- Develop and execute technology roadmaps to achieve process requirements, business objectives, and key milestones.
- Install, qualify, and ramp equipment and manufacturing processes to support new product introductions and production start-up milestones.
- Lead efforts to resolve complex technical challenges and implement robust systems that prevent recurrence.
- Support and sustain development and pilot production lines during early test vehicle and production phases.
- Partner closely with engineers, technicians, integration teams, shift leadership, and management to deliver development and manufacturing commitments.
- Evaluate, qualify, and implement new hardware, software, and equipment upgrades.
- Lead critical task forces and cross-functional initiatives related to areas of ownership and adjacent manufacturing processes.
Desired Behavioral Traits
The successful candidate will demonstrate:
- A strong commitment to safety and a proactive approach to promoting a safe work environment.
- The ability to thrive in a dynamic environment with evolving priorities and technical challenges.
- A results-oriented mindset with strong organizational skills, initiative, resourcefulness, and accountability.
- Excellent analytical and problem-solving skills, with a strong sense of urgency and commitment to achieving business objectives.
- The ability to distill complex technical concepts into clear, actionable communication for stakeholders at all organizational levels.
- Proven success working within high-performing teams, including demonstrated leadership, collaboration, prioritization, and problem-solving capabilities.
- A continuous improvement mindset, with experience applying Lean principles and methodologies to drive operational and manufacturing excellence.
Qualifications:
Minimum Qualifications
- Bachelor's degree in a STEM or related engineering discipline with 4+ years of relevant semiconductor industry experience; or
- Master's degree in a STEM or related engineering discipline with 3+ years of relevant semiconductor industry experience; or
- PhD in a STEM or related engineering discipline with relevant academic or research experience in semiconductor technologies, electronics, mechanical engineering, manufacturing processes, or closely related fields.
Relevant experience may include:
- Semiconductor processing and manufacturing
- Process characterization and optimization
- Manufacturing process control methodologies
- Continuous process improvement initiatives
- Equipment maintenance and troubleshooting
- Design of Experiments (DOE) and data-driven problem solving
Applicable experience may be obtained through a combination of the areas listed above and does not need to be accumulated separately within each discipline.
For candidates qualifying through the PhD pathway, relevant academic research, laboratory work, publications, or dissertation projects may be considered in lieu of additional full-time industry experience.
Preferred Qualifications
- Hands-on experience in a semiconductor manufacturing environment, with a focus on process sustaining and/or process development.
- Knowledge of statistical analysis and experimental design methodologies, including their application to tool matching, tool qualification, and process optimization.
- Understanding of semiconductor process flows (logic and memory) and related metrology techniques and assessments.
- Proven project management skills, including experience leading cross-functional teams or task forces to solve complex technical challenges.
- Strong communication and collaboration skills, with the ability to work effectively across diverse teams, functions, and geographic regions.
Join us in shaping the future of semiconductor innovation. Apply now and become part of a team that is redefining the limits of technology through advanced manufacturing excellence. Minimum Qualifications
Job Type:
Experienced HireShift:
Shift 1 (United States of America)Primary Location:
US, New Mexico, AlbuquerqueAdditional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust
N/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $103,730.00-198,820.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Source: Intel on Workday · View original posting (opens in new tab)
Pay in context
This role's base floor ($103,730) is above 6% of the 1,001 Manufacturing & Production roles nationwide listed on this site. Their median floor is $140,000; the middle half runs from $120,000 to $160,000.
Only jobs on this site count, and each one publishes a base salary of $100,000 or more, so this compares six-figure jobs with each other, not with the whole market. Computed Nov 7, 2026.
This listingNM Wafer Packaging Manufacturing Advanced Packaging EngineerFrom $103,730
Enterprise Systems AnalystFrom $105,300
Firewall Network Security EngineerFrom $105,300
CPU Physical Design EngineerFrom $105,650
SoC Debug EngineerFrom $105,650
Design Verification EngineerFrom $105,650
Ethernet System Integration EngineerFrom $105,650
Chart as a table
| Role | Published base |
|---|---|
| NM Wafer Packaging Manufacturing Advanced Packaging Engineer (this listing) | From $103,730 |
| Enterprise Systems Analyst | From $105,300 |
| Firewall Network Security Engineer | From $105,300 |
| CPU Physical Design Engineer | From $105,650 |
| SoC Debug Engineer | From $105,650 |
| Design Verification Engineer | From $105,650 |
| Ethernet System Integration Engineer | From $105,650 |
Observed changes
- First observed on the employer's board
- Began meeting the published-salary criteria
- Observed since
- Employer-stated posting date
- 2026-11-05
Where this pay comes from
Location as the employer wrote it: US, New Mexico, Albuquerque
Annual Salary Range for jobs which could be performed in the US: $103,730.00-198,820.00 USD
- Method
- Employer text, read with fixed rules and re-verified
- Checked
- Rule set
- us-base-v2
The pay passage appears in the employer's own job text. Fixed, deterministic rules located it, and the passage below was checked against the stored copy of the posting.
What we verified
- The pay figures come from the employer's own listing, quoted exactly above.
- The pay is an annual base salary in US dollars with a minimum of at least $100,000.
- The role was publicly listed on the employer's job board when last checked.
We do not verify what the employer will actually offer, whether the employer is still recruiting for the role, or anything beyond what the employer published. Full methodology.
