Senior Package Layout Engineer - Hardware
Company websitenvidia.com (NVIDIA, opens in new tab)
Base salary $136,000 to $258,750
Employer-published annual base salary, USD. Advertised base range in Santa Clara, CA +5 more
You apply on the employer's own site. Six Figure Work does not handle applications.
- LocationSanta Clara, CA +5 more
- WorkplaceWorkplace not stated
- Status at last checkSource accepting applications when checked
- Last checked (31 min ago) · observed since
All 6 locations
- US, CA, Santa Clara
- US, NV, Remote
- US, OR, Remote
- US, AZ, Remote
- US, WA, Remote
- US, CA, Remote
About this job
NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative, unusual solutions to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through their contributions!
This position will collaborate with Technical Package Lead and different design teams in the design and development of sophisticated, detailed layout of IC substrates for NVIDIA products. In addition, work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues.
What you'll be doing:
As part of a Layout team, you will collaborate to implement high speed/density ASIC packages.
Perform substrate breakout patterns for ASIC packages.
Optimize package pinout incorporating system level trade-offs of pins assignment.
Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.
Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.
Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.
Develop symbols and CAD library databases using Cadence APD design tools
Develop methodologies to improve layout productivity
What we need to see:
Hold a B.S. Electrical Engineering or equivalent experience
5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus
Proven experience in substrate layout of wire bond and flip chip packages, preferred
Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
Solid understanding of high-speed design signal integrity practices
Experience with Virtuoso and Calibre is a plus
Experience using Valor is helpful
NVIDIA is widely considered to be one of the technology world’s most desirable employers! We have some of the most forward-thinking and dedicated people in the world working for us. If you're creative and autonomous, we want to hear from you.
#LI-Hybrid
Your base salary will be determined based on your location, experience, and other objective job-related factors. The expected base salary ranges for this position are:136,000 USD – 212,750 USD for Level 3; and 168,000 USD – 258,750 USD for Level 4.
You will also be eligible for equity and benefits.
Applications for this job will be accepted at least until November 3, 2026.This posting is for an existing vacancy.
NVIDIA uses AI tools in its recruiting processes.
NVIDIA is committed to fostering an inclusive work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.Source: NVIDIA on Workday · View original posting (opens in new tab)
This listingSenior Package Layout Engineer - Hardware$136,000 to $258,750
Public Sector Program Support$136K to $276K
Senior RMA Customer Experience Manager$136,000 to $212,750
Go-to-Market Product Manager$136,000 to $258,750
Senior PR Manager, Datacenter Architecture$136,000 to $270,250
Senior Technical Program Manager - Tegra$136K to $276K
Senior Signal and Power Integrity Engineer$136,000 to $264,500
Chart as a table
| Role | Published base |
|---|---|
| Senior Package Layout Engineer - Hardware (this listing) | $136,000 - $258,750 |
| Public Sector Program Support | $136K - $276K |
| Senior RMA Customer Experience Manager | $136,000 - $212,750 |
| Go-to-Market Product Manager | $136,000 - $258,750 |
| Senior PR Manager, Datacenter Architecture | $136,000 - $270,250 |
| Senior Technical Program Manager - Tegra | $136K - $276K |
| Senior Signal and Power Integrity Engineer | $136,000 - $264,500 |
Observed changes
- First observed on the employer's board
- Began meeting the published-salary criteria
- Observed since
- Employer-stated posting date
- 2026-10-30
Where this pay comes from
Location as the employer wrote it: Multiple locations (6) (Levels 3-4 combined)
136,000 USD – 212,750 USD for Level 3; and 168,000 USD – 258,750 USD for Level 4.
- Method
- Employer text, read with fixed rules and re-verified
- Checked
- Rule set
- us-base-v2
The pay passage appears in the employer's own job text. Fixed, deterministic rules located it, and the passage below was checked against the stored copy of the posting.
What we verified
- The pay figures come from the employer's own listing, quoted exactly above.
- The pay is an annual base salary in US dollars with a minimum of at least $100,000.
- The role was publicly listed on the employer's job board when last checked.
We do not verify what the employer will actually offer, whether the employer is still recruiting for the role, or anything beyond what the employer published. Full methodology.
