Thin Films Module Development Engineer
Company websiteintel.com (Intel, opens in new tab)
Base salary From $155,520
Employer-published annual base salary, USD. Advertised base range in Hillsboro, OR
You apply on the employer's own site. Six Figure Work does not handle applications.
- LocationHillsboro, OR
- WorkplaceWorkplace not stated
- Status at last checkSource accepting applications when checked
- Last checked (27 min ago) · observed since
About this job
Job Details:
Job Description:
Intel Foundry is seeking experienced Thin Films Metals Module Development Engineers to join the Technology Development organization. The role will be defined by developing and delivering metals modules for advanced semiconductor technologies, leveraging a combination of in-depth hardware knowledge and process expertise to deliver modules that fulfill program process needs within the hardware capabilities.
This is a hands-on technical role for results-oriented engineers who can formulate concise technical problem statements, establish a roadmap and timeline, lead with data and partner with stakeholders to deliver on-time results.
Qualifications:
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
- Bachelor's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related STEM fields with 6+ years of experience
OR
- Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related STEM fields with 4+ years of experience
OR
- Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related STEM fields with 2+ years of experience
Experience in semiconductor manufacturing or process development includes one or more of the following:
- Expertise in process optimization, defect reduction, and manufacturing process improvements for advanced technology nodes
- Proficiency in Design of Experiments (DOE), Statistical Process Control (SPC), and structured problem-solving methodologies
- Hands-on expertise in dry etch processes, material science, and equipment metrology
- Technical experience with semiconductor manufacturing equipment and collaboration with suppliers to optimize hardware and materials
Preferred Qualifications:
- Doctoral degree in a relevant engineering or science field
- Experience with sub-10nm technology nodes and advanced device architectures like FinFET or Gate-All-Around (GAA)
- Proven record of delivering process solutions in Technology Development (TD) and High Volume Manufacturing (HVM)
- Cross-functional leadership experience for yield improvement, defect reduction, or technology ramp initiatives
- Experience mentoring engineers and providing technical guidance
- Strong ownership mindset with the ability to lead initiatives from concept through implementation
For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information
Job Type:
Experienced HireShift:
Shift 1 (United States of America)Primary Location:
US, Oregon, HillsboroAdditional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust
N/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $155,520.00-255,200.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Source: Intel on Workday · View original posting (opens in new tab)
This listingThin Films Module Development EngineerFrom $155,520
Senior / Staff Dry Etch Process Development EngineerFrom $155,520
TD Memory Quality and Reliability EngineerFrom $155,520
Module Development Defect Metrology EngineerFrom $155,520
Intel Mask Operations Module Development EngineerFrom $155,520
Packaging Module Development EngineerFrom $155,520
Technical Lab Operations ManagerFrom $155,520
Chart as a table
| Role | Published base |
|---|---|
| Thin Films Module Development Engineer (this listing) | From $155,520 |
| Senior / Staff Dry Etch Process Development Engineer | From $155,520 |
| TD Memory Quality and Reliability Engineer | From $155,520 |
| Module Development Defect Metrology Engineer | From $155,520 |
| Intel Mask Operations Module Development Engineer | From $155,520 |
| Packaging Module Development Engineer | From $155,520 |
| Technical Lab Operations Manager | From $155,520 |
Observed changes
- First observed on the employer's board
- Began meeting the published-salary criteria
- Observed since
- Employer-stated posting date
- 2026-10-30
Where this pay comes from
Location as the employer wrote it: US, Oregon, Hillsboro
Annual Salary Range for jobs which could be performed in the US: $155,520.00-255,200.00 USD
- Method
- Employer text, read with fixed rules and re-verified
- Checked
- Rule set
- us-base-v2
The pay passage appears in the employer's own job text. Fixed, deterministic rules located it, and the passage below was checked against the stored copy of the posting.
What we verified
- The pay figures come from the employer's own listing, quoted exactly above.
- The pay is an annual base salary in US dollars with a minimum of at least $100,000.
- The role was publicly listed on the employer's job board when last checked.
We do not verify what the employer will actually offer, whether the employer is still recruiting for the role, or anything beyond what the employer published. Full methodology.
