Process Integration Development Engineer
Company websiteintel.com (Intel, opens in new tab)
Base salary From $133,800
Employer-published annual base salary, USD. Advertised base range in Hillsboro, OR
You apply on the employer's own site. Six Figure Work does not handle applications.
- LocationHillsboro, OR
- WorkplaceWorkplace not stated
- Status at last checkSource accepting applications when checked
- Last checked (1 h ago) · observed since
About this job
Job Details:
Job Description:
At Intel, we are at the forefront of innovation, creating world-changing technology that enriches the lives of every person on planet. The Foundry labs directly support advancement of Intel's technology development. The transmission electron microscopy group supports engineering activities in fabrication, failure analysis, technology development, process development, process integration, and pathfinding. Our job is to understand where our manufacturing process and metrologies need to be improved. We are looking for engineers who love solving technical problems, are driven to achieve results, and are flexible in adapting to new methods, tools, and fields of study depending on what is needed to solve the problem at hand. The position will involve characterizing semiconductor nano-devices using advanced transmission electron microscopy (TEM) to expand analytical capabilities. The Time-To-Information-Return (TTIR) of this imaging analysis is critical to TD as we advance process nodes and require revolutionary changes in our support structure and methodologies. We are embarking on those changes. The position is responsible for TEM sample preparation, TEM sample imaging and analysis in high throughput environment. The Engineer will be responsible for but not limited to: o Technical functions in support of engineering activities such as fabrication, failure analysis, technology development, process development, and process integration. o Collaborates with engineering teams to optimize metrology strategies and troubleshoot process flow issues. o Conducts engineering tasks and detailed technical procedures to perform sample preparation or imaging using advanced focused-ion-beam and/or transmission electron microscope tools in support of the research and development activities of Intel. o Contributes to continuous improvement efforts in high volume manufacturing environments. o Performs other related duties as required or as directed. o Continuous upgrading of skill set; requires an open attitude and skills to learn from.Qualifications:
You must possess the minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications:
o PhD degree in a Technical Area (Materials Science, Chemistry, Physics or comparable field).
o At least 2 years of experience with Transmission Electron Microscopy (TEM) operation.
o At least 1 year of experience with Python scripting or MATLAB or other programming languages.
Preferred qualifications:
o Hands-on Experience with TEM sample preparation and/or TEM sample imaging with automation.
o Hands-on Experience with Advanced Transmission Electron Microscopy, such as EELS, EDX and/or 4D STEM.
o Knowledge of electron optics.
o Knowledge of semiconductor process integration.
Job Type:
Experienced HireShift:
Shift 1 (United States of America)Primary Location:
US, Oregon, HillsboroAdditional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust
N/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Source: Intel on Workday · View original posting (opens in new tab)
This listingProcess Integration Development EngineerFrom $133,800
Module Development Engineering ManagerFrom $133,800
Intel Foundry Module Development EngineerFrom $133,800
Defect Characterization Low Yield Analysis EngineerFrom $133,800
Packaging Module Development EngineerFrom $133,800
Process Integration Development Engineer - TD Defect MetrologyFrom $133,800
Module Development EngineerFrom $133,800
Chart as a table
| Role | Published base |
|---|---|
| Process Integration Development Engineer (this listing) | From $133,800 |
| Module Development Engineering Manager | From $133,800 |
| Intel Foundry Module Development Engineer | From $133,800 |
| Defect Characterization Low Yield Analysis Engineer | From $133,800 |
| Packaging Module Development Engineer | From $133,800 |
| Process Integration Development Engineer - TD Defect Metrology | From $133,800 |
| Module Development Engineer | From $133,800 |
Observed changes
- First observed on the employer's board
- Began meeting the published-salary criteria
- Observed since
- Employer-stated posting date
- 2026-10-05
Where this pay comes from
Location as the employer wrote it: US, Oregon, Hillsboro
Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD
- Method
- Employer text, read with fixed rules and re-verified
- Checked
- Rule set
- us-base-v2
The pay passage appears in the employer's own job text. Fixed, deterministic rules located it, and the passage below was checked against the stored copy of the posting.
What we verified
- The pay figures come from the employer's own listing, quoted exactly above.
- The pay is an annual base salary in US dollars with a minimum of at least $100,000.
- The role was publicly listed on the employer's job board when last checked.
We do not verify what the employer will actually offer, whether the employer is still recruiting for the role, or anything beyond what the employer published. Full methodology.
