Process Integration Development Engineer - TD Defect Metrology
Company websiteintel.com (Intel, opens in new tab)
Base salary From $133,800
Employer-published annual base salary, USD. Advertised base range in Hillsboro, OR
You apply on the employer's own site. Six Figure Work does not handle applications.
- LocationHillsboro, OR
- WorkplaceWorkplace not stated
- Status at last checkSource accepting applications when checked
- Last checked (28 min ago) · observed since
About this job
Job Details:
Job Description:
Embark with us on a journey of growth and transformation as we create exceptionally engineered technology and bring AI everywhere. As a valued team member, your adaptability and attention to detail will contribute to our drive for results and relentless pursuit of quality, ensuring we meet our customers' needs with precision.
Join us and build on our legacy of innovation and collaboration as we deliver world‑changing technology that improves the life of every person on the planet.
Life at Intel: https://jobs.intel.com/en/life-at-intel
As a Process Integration Development Engineer, you will play a pivotal role in advancing semiconductor technology by designing, executing, and analyzing experiments to enhance process performance. Using cutting-edge materials and equipment, you will develop integrated solutions to meet quality, reliability, and manufacturability requirements, driving technology transfer to high-volume manufacturing. Your work will directly contribute to optimizing outputs and shaping Intel's future innovations.
Joining Intel Foundry's Logic Technology Development (LTD), you will be part of a team focused on driving advancements in silicon process technology. LTD is at the forefront of sustaining Moore's Law by enabling world-class semiconductor manufacturing. The group collaborates across engineering disciplines to develop processes that meet Intel's high standards for yield, performance, and reliability, ensuring the delivery of groundbreaking technology to our customers.
Your responsibilities may include but not limited to:
- Plan and execute experiments to fully characterize processes throughout the development cycle and improve product performance.
- Develop and qualify materials and equipment to meet reliability, cost, and manufacturability requirements.
- Conduct feasibility studies and identify process solutions in collaboration with product and module engineering teams.
- Leverage big data analysis to identify and resolve process design weaknesses or manufacturing tool issues.
- Lead new product qualifications and ensure seamless technology transfers to high-volume manufacturing using the Copy Exactly methodology.
- Collaborate with development teams and material suppliers to align processes with technology roadmaps.
- Organize and present process solutions to engineering teams to address customer requests or resolve issues.
Qualifications:
Candidates must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. The experience listed below may be obtained through schoolwork, classes and project work, internships, military training, and/or work experience.
Minimum Qualifications:
- Ph.D. in Computer Science, Physics, Materials Science and Engineering, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Nuclear Engineering, Optics, Chemistry, or a related field; OR
- Master's degree in the aforementioned fields with 4+ years of engineering industry experience.
- Experience in materials characterization techniques such as SEM, TEM, Spectroscopy or other metrology tools.
- Experience with semiconductor processing fundamentals, including lithography, etching, polishing, chemical/physical reactions, or device physics.
- Experience in statistical or data analysis tools like MATLAB, JMP, or Excel, and familiarity with design of experiments (DOE) principles.
Preferred Qualifications:
- Proven experience in defect reduction or process integration within semiconductor manufacturing.
- Knowledge of Statistical Process Control (SPC) methods or advanced process controls (APC).
- Expertise in advanced transistor device structures and architectures, including fabrication processes.
- Proficiency in scripting languages (e.g., Python, Perl) or programming languages (e.g., SQL, C++).
- Strong communication skills and a collaborative mindset to foster trust and partnerships across engineering teams.
Take advantage of this opportunity to join Intel and shape the future of engineering. Apply today to be part of a team that drives industry-leading innovation and transformation.
Interview Tips: https://www.intel.com/content/www/us/en/jobs/hiring.html
Job Type:
Experienced HireShift:
Shift 1 (United States of America)Primary Location:
US, Oregon, HillsboroAdditional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust
N/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00-219,550.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Source: Intel on Workday · View original posting (opens in new tab)
This listingProcess Integration Development Engineer - TD Defect MetrologyFrom $133,800
Module Development Engineering ManagerFrom $133,800
Intel Foundry Module Development EngineerFrom $133,800
Defect Characterization Low Yield Analysis EngineerFrom $133,800
Packaging Module Development EngineerFrom $133,800
Module Development EngineerFrom $133,800
Staff Chemical Mechanical Planarization (CMP) EngineerFrom $133,800
Chart as a table
| Role | Published base |
|---|---|
| Process Integration Development Engineer - TD Defect Metrology (this listing) | From $133,800 |
| Module Development Engineering Manager | From $133,800 |
| Intel Foundry Module Development Engineer | From $133,800 |
| Defect Characterization Low Yield Analysis Engineer | From $133,800 |
| Packaging Module Development Engineer | From $133,800 |
| Module Development Engineer | From $133,800 |
| Staff Chemical Mechanical Planarization (CMP) Engineer | From $133,800 |
Observed changes
- First observed on the employer's board
- Began meeting the published-salary criteria
- Observed since
- Employer-stated posting date
- 2026-11-03
Where this pay comes from
Location as the employer wrote it: US, Oregon, Hillsboro
Annual Salary Range for jobs which could be performed in the US: $133,800.00-219,550.00 USD
- Method
- Employer text, read with fixed rules and re-verified
- Checked
- Rule set
- us-base-v2
The pay passage appears in the employer's own job text. Fixed, deterministic rules located it, and the passage below was checked against the stored copy of the posting.
What we verified
- The pay figures come from the employer's own listing, quoted exactly above.
- The pay is an annual base salary in US dollars with a minimum of at least $100,000.
- The role was publicly listed on the employer's job board when last checked.
We do not verify what the employer will actually offer, whether the employer is still recruiting for the role, or anything beyond what the employer published. Full methodology.
