Semiconductor Research Engineer
Company websiteintel.com (Intel, opens in new tab)
Base salary From $141,910
Employer-published annual base salary, USD. Advertised base range in Chandler, AZ
You apply on the employer's own site. Six Figure Work does not handle applications.
- LocationChandler, AZ
- WorkplaceWorkplace not stated
- Status at last checkSource accepting applications when checked
- Last checked (3 h ago) · observed since
About this job
Job Details:
Job Description:
As a Semiconductor Research Engineer, you will play a crucial role in advancing Intel's assembly and packaging technologies. You will design, develop, and test innovative devices, interconnects, and packaging solutions, leveraging device physics, electromagnetics, and materials science. Your hands-on work will include prototyping and research to optimize performance, reliability, and cost, directly impacting Intel's technological leadership in semiconductor innovation.
Business Group
Intel Corporation's Assembly Materials Characterization Lab, in Core Competency of Advanced Design and Customer Enabling is dedicated to enabling next-generation semiconductor technologies. This group combines cutting-edge research and development to deliver next generation metrology solution for advanced packaging solutions that drive miniaturization, performance enhancements, and functionality. As part of this dynamic team, you will contribute to Intel's mission to enhance technological capabilities and maintain industry leadership.
Key Responsibilities
- Conduct research using device physics, optics, electromagnetics, and thermomechanical analysis to enable novel devices and packaging technologies.
- Design and fabricate metrology prototypes to validate groundbreaking concepts for semiconductor assembly and interconnect solutions.
- Develop testing methodologies for component and device characterization, including dimension, optical signal loss, and stressing.
- Plan and execute experiments with cross-functional teams to benchmark results against industry standards.
- Model and analyze trade-offs between design, performance, and reliability to ensure optimal solutions.
- Collaborate with external vendors and researchers to support Intel's research pipeline.
Behavioral traits:
- Lead and influence technical teams to achieve milestones.
- Analytical and problem-solving abilities to address unique engineering challenges.
- Excellent organizational and communication skills, with experience presenting findings and mentoring team members.
Qualifications:
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.
Minimum Qualifications
- Master's in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field with 4+ years of experience- OR- PhD degree with 2+ years of experience.
- Experience mentioned above should be in the following areas:
- Research, including optical test metrology, Dimensional metrology, and packaging design methodologies.
- Programming skills in Python or MATLAB for engineering applications.
- Experimental setups and data analysis techniques for lab testing.
Preferred Qualifications
- Experience with advanced Co-Packaged Optics (CPO).
- Experience with advanced packaging technologies like EMIB and Foveros architectures.
- Expertise in Design of Experiments (DOE), statistical analysis methods, and model-based problem-solving techniques.
- Familiarity with materials characterization techniques and cross-disciplinary collaboration.
Join a team that thrives on innovation, collaboration, and excellence. Be part of shaping the future of semiconductor technology with Intel-apply today.
Job Type:
Experienced HireShift:
Shift 1 (United States of America)Primary Location:
US, Arizona, PhoenixAdditional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust
N/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $141,910.00-200,340.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Source: Intel on Workday · View original posting (opens in new tab)
Pay in context
This role's base floor ($141,910) is above 28% of the 3,637 Data & ML roles nationwide listed on this site. Their median floor is $169,400; the middle half runs from $137,400 to $200,000.
Only jobs on this site count, and each one publishes a base salary of $100,000 or more, so this compares six-figure jobs with each other, not with the whole market. Computed Nov 7, 2026.
This listingSemiconductor Research EngineerFrom $141,910
Factory Construction Project / Program ManagerFrom $140,220
Senior Capacity and Strategic Planning EngineerFrom $140,830
Sr Back-End Facilities Development EngineerFrom $140,830
Packaging Quality and Reliability EngineerFrom $140,830
Senior Facilities Mechanical EngineerFrom $140,830
Senior Product Failure Analysis EngineerFrom $140,830
Chart as a table
| Role | Published base |
|---|---|
| Semiconductor Research Engineer (this listing) | From $141,910 |
| Factory Construction Project / Program Manager | From $140,220 |
| Senior Capacity and Strategic Planning Engineer | From $140,830 |
| Sr Back-End Facilities Development Engineer | From $140,830 |
| Packaging Quality and Reliability Engineer | From $140,830 |
| Senior Facilities Mechanical Engineer | From $140,830 |
| Senior Product Failure Analysis Engineer | From $140,830 |
Observed changes
- First observed on the employer's board
- Began meeting the published-salary criteria
- Observed since
- Employer-stated posting date
- 2026-11-05
Where this pay comes from
Location as the employer wrote it: US, Arizona, Phoenix
Annual Salary Range for jobs which could be performed in the US: $141,910.00-200,340.00 USD
- Method
- Employer text, read with fixed rules and re-verified
- Checked
- Rule set
- us-base-v2
The pay passage appears in the employer's own job text. Fixed, deterministic rules located it, and the passage below was checked against the stored copy of the posting.
What we verified
- The pay figures come from the employer's own listing, quoted exactly above.
- The pay is an annual base salary in US dollars with a minimum of at least $100,000.
- The role was publicly listed on the employer's job board when last checked.
We do not verify what the employer will actually offer, whether the employer is still recruiting for the role, or anything beyond what the employer published. Full methodology.
