Reliability Lab Shock and Vibration Testing Engineer
Company websiteintel.com (Intel, opens in new tab)
Base salary From $115,110
Employer-published annual base salary, USD. Advertised base range in Chandler, AZ
You apply on the employer's own site. Six Figure Work does not handle applications.
- LocationChandler, AZ
- WorkplaceWorkplace not stated
- Status at last checkSource accepting applications when checked
- Last checked (25 min ago) · observed since
About this job
Job Details:
Job Description:
The Stress Test and Reliability Laboratory organization is looking for a dynamic, hands-on engineer to join their environmental stress tool engineering team in Chandler, AZ. The lab engineering team develops and maintains a fleet of equipment which is used to evaluate Intel's silicon, package, and assembly technologies under simulated field use including heat, humidity, temperature change, and dynamic stresses such as shock and vibration.
This role will focus on supporting our dynamics stress capability. In this role, you will be responsible for developing, executing, and analyzing mechanical reliability and environmental stress testing programs for semiconductor devices, boards, and assemblies. The role requires expertise in shock, vibration, and dynamic mechanical loading methodologies with a strong emphasis on industry-standard test requirements and a deep knowledge of the physics of failure.
Responsibilities will include but are not limited to:
- Develop, plan, and execute dynamic stress tests, including shock, vibration, and other test methods in compliance with JEDEC, IPC, and/or customer requirements
- Develop test fixtures, instrumentation strategies, and data acquisition systems to support mechanical reliability evaluations.
- Working with the operations team, perform testing on devices
- Analyze test data using statistical and engineering methods to identify failure modes, performance limits, and reliability risks.
- Correlate test data to mechanical models to validate and improve simulation results
- Generate detailed test plans, procedures, reports, and qualification documentation.
- Drive continuous improvement of laboratory capabilities, test automation, and best practices for dynamic stress testing.
- Ensure laboratory operations comply with applicable safety, quality, and calibration requirements.
- Provide technical guidance regarding shock and vibration requirements throughout the product development lifecycle.
Qualifications:
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Requirements
Degree in Mechanical Engineering, Aerospace Engineering, Materials Engineering, or similar STEM related degree:
- BS with 4+ years of experience in shock and vibration stress testing/methods
- -OR- MS with 1+ years of experience in shock and vibration stress testing/methods
- - OR- PhD with 6 months+ of experience in shock and vibration stress testing/methods
Experience can come from a combination of educational and work experience and may include:
- Hands-on experience conducting shock and vibration testing using electrodynamic shakers and mechanical shock equipment.
- Working knowledge of JEDEC and/or IPC standards related to board-level reliability and mechanical stress testing.
- Experience developing test plans, procedures, and qualification reports.
- Proficiency with data acquisition systems, accelerometers, strain gauges, and vibration control software.
- Experience analyzing vibration and shock response data and interpreting failure mechanisms.
- Understanding of finite element analysis (FEA) results and correlation to physical testing.
Preferred Qualifications
- Deep expertise with JEDEC standards such as JESD22-B103, JESD22-B110, JESD22-B111, and other relevant mechanical reliability requirements.
- Experience interpreting and applying IPC standards including IPC-9703 and related solder joint reliability specifications.
- Familiarity with military, aerospace, or transportation standards such as MIL-STD-810, ASTM, and IEC environmental test methods
- Advanced knowledge of vibration analysis, modal analysis, frequency response functions (FRFs), and resonance characterization.
- Proficiency with FEA tools such as Comsol Multiphysics, ANSYS, Abaqus, or Nastran.
- Experience with standard and high-speed data acquisition systems (including DMM) and automated test scripting using Python, MATLAB, or LabVIEW.
- Laboratory leadership experience, including test equipment specification, procurement, calibration management, and mentoring junior engineers.
- Proficiency in electrical measurements, calibration, and troubleshooting programmable DC power supplies, multimeters, and other instrumentation.
- Experience with data acquisition systems, instrumentation communication protocols (e.g., Ethernet, RS-232, GPIB), and automated test equipment.
- Knowledge of design of experiments, statistical process control, and measurement system analysis.
- Strong troubleshooting, root cause analysis, and problem-solving skills.
- Excellent written and verbal communication skills.
- Ability to work effectively in cross-functional engineering environments.
Your expertise and enthusiasm for engineering excellence can help shape the future of semiconductor innovation. Join our team and contribute to groundbreaking technological advancements by applying today.
Job Type:
Experienced HireShift:
Shift 1 (United States of America)Primary Location:
US, Arizona, PhoenixAdditional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust
N/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Source: Intel on Workday · View original posting (opens in new tab)
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Silicon Photonics TD Process/Product Integration EngineerFrom $115,110
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Chart as a table
| Role | Published base |
|---|---|
| Reliability Lab Shock and Vibration Testing Engineer (this listing) | From $115,110 |
| Senior Advanced Packaging Defect Inspection Engineer | From $115,110 |
| Module Development Engineer - LTD Dry Etch | From $115,110 |
| Silicon Photonics TD Process/Product Integration Engineer | From $115,110 |
| Yield Development Engineer | From $115,110 |
| Process Integration Development Engineer | From $115,110 |
| Module Development Engineer - RF Test | From $115,110 |
Observed changes
- First observed on the employer's board
- Began meeting the published-salary criteria
- Observed since
- Employer-stated posting date
- 2026-10-13
Where this pay comes from
Location as the employer wrote it: US, Arizona, Phoenix
Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD
- Method
- Employer text, read with fixed rules and re-verified
- Checked
- Rule set
- us-base-v2
The pay passage appears in the employer's own job text. Fixed, deterministic rules located it, and the passage below was checked against the stored copy of the posting.
What we verified
- The pay figures come from the employer's own listing, quoted exactly above.
- The pay is an annual base salary in US dollars with a minimum of at least $100,000.
- The role was publicly listed on the employer's job board when last checked.
We do not verify what the employer will actually offer, whether the employer is still recruiting for the role, or anything beyond what the employer published. Full methodology.
