Process Integration Development Engineer
Company websiteintel.com (Intel, opens in new tab)
Base salary From $115,110
Employer-published annual base salary, USD. Advertised base range in Hillsboro, OR
You apply on the employer's own site. Six Figure Work does not handle applications.
- LocationHillsboro, OR
- WorkplaceWorkplace not stated
- Status at last checkSource accepting applications when checked
- Last checked (1 h ago) · observed since
About this job
Job Details:
Job Description:
Embark with us on a journey of growth and transformation as we create exceptionally engineered technology and bring AI everywhere. As a valued team member, your adaptability and attention to detail will contribute to our drive for results and relentless pursuit of quality, ensuring we meet our customers' needs with precision.
Join us and build on our legacy of innovation and collaboration as we deliver world‑changing technology that improves the life of every person on the planet.
Life at Intel: https://jobs.intel.com/en/life-at-intel
At Intel's Logic Technology Development (LTD) we have continued to extend Moore's law to be world leaders in computing technology. To achieve the necessary scaling of our semiconductor manufacturing process, we have led the industry in developing enhancements such as strained silicon for carrier transport enhancement, high-k metal gates, and FINFETs. LTD has been at the center of every new development that has kept Moore's Law moving forward. TMI Integration plays a key role in the development of every new silicon process development. Our analysis builds the plan that allows LTD to take technology from the research phase to the high-volume manufacturing phase while maintaining high-quality standards. In the MIE organization, we engineer world-class yields on D1 processes by driving critical Fab and E-Test parameters to Best-in-Class targets. As a TMI Integration engineer, you will be responsible for identifying all the process parameters that impact yield and performance in an advanced silicon process technology. You will characterize the process using cutting-edge metrology tools. With this characterization, you will be responsible for creating a yield cliff parameter improvement roadmap. You will then work directly with modules and TD integration to drive that roadmap by developing and qualifying process fixes. This role provides an opportunity to influence Intel's future process technologies that will keep Moore's Law moving forward.
Responsibilities will include but will not be limited to:
- Provide navigation and leadership to meet Intel's yield objectives.
- Organizing and presenting process parameter summaries to LTD engineering teams.
- Partnering with Intel TD Integration, Yield, and Module engineers to drive root cause understanding for all critical process parameters.
- Institute ramp to manufacturing volumes to demonstrate the technology meets requirements while simultaneously transferring the technology to counterparts in manufacturing via the Copy Exactly Methodology.
- Hold the team and collaborators accountable for quality through TMIs and FTs.
- Role-model and establish a team culture of trust, collaboration, safety, accountability, and excellence.
- Build strong relationships with other LTD process and design teams based on mutual trust and respect.
- An ideal candidate should be willing to demonstrate the below behavioral traits - Strong data analysis and problem debug skills, Excellent communication skills, Understand and adhere to key Intel values.
Qualifications:
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates Experience listed below would be obtained through a combination of your schoolwork, classes, research and/or relevant previous job and/or internship experiences.
Minimum Qualifications:
The ideal candidate must possess at least one of the following:
- Bachelor's degree in Computer/Data Science, Physics, Materials Science and Engineering, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Nuclear Engineering, Optics, Chemistry, or any related field (with focus on hands-on experimental research) with 4+ years of Engineering Industry experience; OR
- Master's degree in Computer/Data Science, Physics, Materials Science and Engineering, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Nuclear Engineering, Optics, Chemistry, or any related field (with focus on hands-on experimental research) with 3+ years of Engineering Industry experience; OR
- PHD in Computer/Data Science, Physics, Materials Science and Engineering, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Nuclear Engineering, Optics, Chemistry, or any related field (with focus on hands-on experimental research).
Preferred Qualifications:
1+ year’s experience with one or more of the following:
- Materials characterization (SEM, TEM, etc.), materials fabrication, synthesis, metrology, statistical or data analysis (MATLAB, Excel, JMP, etc.)
- Semiconductor processing fundamentals (lithography, wet and or dry etch, chemical and or mechanical polishing, etc.), semiconductor and or transistor device physics, and design of experiments.
- Demonstrate experience of Statistical Process Control SPC or Design of Experiments (DOE) principles.
Take advantage of this opportunity to join Intel and shape the future of engineering. Apply today to be part of a team that drives industry-leading innovation and transformation.
Interview Tips: https://www.intel.com/content/www/us/en/jobs/hiring.html
Job Type:
Experienced HireShift:
Shift 1 (United States of America)Primary Location:
US, Oregon, HillsboroAdditional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust
N/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Source: Intel on Workday · View original posting (opens in new tab)
This listingProcess Integration Development EngineerFrom $115,110
Senior Advanced Packaging Defect Inspection EngineerFrom $115,110
Reliability Lab Shock and Vibration Testing EngineerFrom $115,110
Module Development Engineer - LTD Dry EtchFrom $115,110
Silicon Photonics TD Process/Product Integration EngineerFrom $115,110
Yield Development EngineerFrom $115,110
Module Development Engineer - RF TestFrom $115,110
Chart as a table
| Role | Published base |
|---|---|
| Process Integration Development Engineer (this listing) | From $115,110 |
| Senior Advanced Packaging Defect Inspection Engineer | From $115,110 |
| Reliability Lab Shock and Vibration Testing Engineer | From $115,110 |
| Module Development Engineer - LTD Dry Etch | From $115,110 |
| Silicon Photonics TD Process/Product Integration Engineer | From $115,110 |
| Yield Development Engineer | From $115,110 |
| Module Development Engineer - RF Test | From $115,110 |
Observed changes
- First observed on the employer's board
- Began meeting the published-salary criteria
- Observed since
- Employer-stated posting date
- 2026-10-27
Where this pay comes from
Location as the employer wrote it: US, Oregon, Hillsboro
Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD
- Method
- Employer text, read with fixed rules and re-verified
- Checked
- Rule set
- us-base-v2
The pay passage appears in the employer's own job text. Fixed, deterministic rules located it, and the passage below was checked against the stored copy of the posting.
What we verified
- The pay figures come from the employer's own listing, quoted exactly above.
- The pay is an annual base salary in US dollars with a minimum of at least $100,000.
- The role was publicly listed on the employer's job board when last checked.
We do not verify what the employer will actually offer, whether the employer is still recruiting for the role, or anything beyond what the employer published. Full methodology.
