Module Development Engineer
Company websiteintel.com (Intel, opens in new tab)
Base salary From $133,800
Employer-published annual base salary, USD. Advertised base range in Hillsboro, OR
You apply on the employer's own site. Six Figure Work does not handle applications.
- LocationHillsboro, OR
- WorkplaceWorkplace not stated
- Status at last checkSource accepting applications when checked
- Last checked (1 h ago) · observed since
About this job
Job Details:
Job Description:
The Role and Impact:
As a Module Development Engineer, you will play a critical role in advancing Intel's semiconductor technologies by developing and optimizing complex manufacturing processes. You will design experiments, analyze results, and collaborate with cross-disciplinary teams to ensure the successful integration of innovative device architectures. Your contributions will directly impact the quality, scalability, and advancement of Intel's technology roadmap, driving industry-leading solutions in semiconductor manufacturing.
Business Group:
As part of Intel Foundry, you will join a forward-thinking team committed to delivering cutting-edge process technologies and enabling advancements in Intel's product roadmap. This group fosters collaboration across diverse scientific disciplines to ensure Intel's leadership in semiconductor innovation. By joining this dynamic team, you will help shape the future of computing and technology.
Key Responsibilities:
- Design, execute, and analyze experiments to develop next-generation semiconductor processes
- Develop and optimize advanced manufacturing techniques, including material selection, parameter tuning, and equipment metrology
- Perform pathfinding activities to enable innovative device architectures and align them with future roadmaps
- Collaborate with cross-functional teams to integrate individual process steps into cohesive manufacturing flows
- Partner with equipment and material suppliers to enhance process capabilities and deliver robust solutions
- Recommend and implement equipment modifications to improve efficiency, scalability, and consistency
- Drive ramp-up to high-volume manufacturing using Intel's Copy Exactly Methodology
- Analyze trends in the semiconductor industry and align Intel's technology needs with emerging advancements
Qualifications:
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications:
- Master's degree in STEM related field with 5+ years of semiconductor processing and fabrication experience
OR
- PhD degree in STEM related field with 3+ years of semiconductor processing and fabrication experience
Preferred Qualifications:
- Proven expertise in thin films processing or device fabrication with advanced hands-on development experience
- In-depth knowledge of films processing methodologies and optimization techniques
- Experience leading cross-functional teams and driving complex technical projects to successful outcomes
- Familiarity with process control systems, variability sources, and advanced statistical methods
- Demonstrated ability to communicate technical concepts effectively in a multidisciplinary environment
For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information
Job Type:
Experienced HireShift:
Shift 1 (United States of America)Primary Location:
US, Oregon, HillsboroAdditional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust
N/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Source: Intel on Workday · View original posting (opens in new tab)
This listingModule Development EngineerFrom $133,800
Module Development Engineering ManagerFrom $133,800
Intel Foundry Module Development EngineerFrom $133,800
Defect Characterization Low Yield Analysis EngineerFrom $133,800
Packaging Module Development EngineerFrom $133,800
Process Integration Development Engineer - TD Defect MetrologyFrom $133,800
Module Development EngineerFrom $133,800
Chart as a table
| Role | Published base |
|---|---|
| Module Development Engineer (this listing) | From $133,800 |
| Module Development Engineering Manager | From $133,800 |
| Intel Foundry Module Development Engineer | From $133,800 |
| Defect Characterization Low Yield Analysis Engineer | From $133,800 |
| Packaging Module Development Engineer | From $133,800 |
| Process Integration Development Engineer - TD Defect Metrology | From $133,800 |
| Module Development Engineer | From $133,800 |
Observed changes
- First observed on the employer's board
- Began meeting the published-salary criteria
- Observed since
- Employer-stated posting date
- 2026-11-03
Where this pay comes from
Location as the employer wrote it: US, Oregon, Hillsboro
Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD
- Method
- Employer text, read with fixed rules and re-verified
- Checked
- Rule set
- us-base-v2
The pay passage appears in the employer's own job text. Fixed, deterministic rules located it, and the passage below was checked against the stored copy of the posting.
What we verified
- The pay figures come from the employer's own listing, quoted exactly above.
- The pay is an annual base salary in US dollars with a minimum of at least $100,000.
- The role was publicly listed on the employer's job board when last checked.
We do not verify what the employer will actually offer, whether the employer is still recruiting for the role, or anything beyond what the employer published. Full methodology.
