Principal Die-to-Die Interconnect Modeling Architect
Company websitebroadcom.com (Broadcom, opens in new tab)
Base salary $167,500 to $268,000
Employer-published annual base salary, USD. Advertised base range in San Jose Innovation Drive, CA +1 more
You apply on the employer's own site. Six Figure Work does not handle applications.
- LocationSan Jose Innovation Drive, CA +1 more
- WorkplaceWorkplace not stated
- Status at last checkSource accepting applications when checked
- Last checked (2 h ago) · observed since
All places named
- San Jose Innovation Drive, CA
- USA-Colorado-Fort Collins-4380 Ziegler Road
About this job
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Job Description:
We are seeking a Modeling Architect to lead a technical team in building and evolving our foundational modeling platform for die-to-die (D2D) PHYs designs. This role focuses on communication theory, algorithm development, system-level modeling, performance prediction, adaptation algorithm modeling, and architectural verification
The successful candidate will perform evaluation and tradeoff analysis using statistical tools over different signaling schemes (e.g., NZR vs. other), and analyze hardware architecture and implementation tradeoffs (equalization, error terms, noise budgets, etc.). Leading a technical team, the architect will drive algorithm verification of Verilog implementations, predictive adaptation algorithm run-time modeling, Monte Carlo evaluations of adaptation algorithms, and architectural verification with silicon correlation to achieve high model-to-silicon alignment.
This role requires deep technical understanding of communication algorithms, timing and margin budgeting, equalization and error term analysis, and focus on cross-functional technical leadership.
Key Responsibilities
System Modeling and Performance Prediction
- Develop comprehensive behavioral and architectural models that accurately predict complete link behavior before implementation.
- Build system-level models using MATLAB, Python, SystemC, or equivalent modeling environments.
- Model transmitter, receiver, package, channel, clocking, equalization, adaptation, and protocol interactions.
- Predict link performance including BER, latency, throughput, bandwidth density, power consumption, energy efficiency, and manufacturing margin.
- Perform architectural sensitivity analyses across process, voltage, temperature (PVT), aging, package variation, jitter, noise, and channel impairments.
- Apply communication theory to help develop robust, high-performance signaling architectures.
- Analyze equalization, timing recovery, clock recovery, calibration, and adaptive signal processing algorithms.
- Evaluate convergence behavior, numerical stability, hardware efficiency, and implementation feasibility.
- Guide algorithm development from mathematical concepts through production silicon implementation.
- Model deterministic and random timing uncertainties including jitter, skew, supply noise, process variation, and environmental effects.
- Establish margin methodologies that ensure robust operation across manufacturing and operating conditions.
- Collaborate with implementation teams to ensure timing assumptions are achievable in silicon.
Architectural Verification and Silicon Correlation
- Define the architectural verification strategy to ensure system requirements are traceable from concept through production silicon.
- Develop behavioral reference models that serve as the golden standard for RTL implementation, verification, software development, and silicon validation.
- Establish architecture-level performance metrics, verification methodologies, and success criteria.
- Drive correlation between behavioral models, RTL simulation, laboratory characterization, and production silicon.
- Validate architectural assumptions through simulation and silicon measurements, identifying performance gaps and driving corrective actions.
- Develop verification methodologies that account for implementation effects including finite precision, analog non-idealities, and hardware constraints.
- Define comprehensive validation strategies covering nominal operation, corner cases, interoperability, and robustness across all operating conditions.
Technical Leadership
- Provide technical leadership across architecture, analog, digital, firmware, packaging, signal integrity, verification, validation, and product engineering organizations.
- Lead architecture reviews and critical technical decision-making throughout the product lifecycle.
- Mentor engineers and architects in communication systems, modeling, and architecture development.
- Influence technology roadmaps and drive innovation in next-generation die-to-die communication systems.
Required Qualifications
- MS in Electrical Engineering, Computer Engineering, and 15 or more years in related field experience; or PhD in Electrical Engineering, Computer Engineering, and 12 or more years in related field experience.
- Deep understanding of communication theory, equalization, and adaptive algorithms.
- Experience in high-speed SerDes, or D2D communication systems architecture.
- Extensive experience developing behavioral and architectural models using MATLAB, Python, SystemC, or equivalent tools.
- Experience with architecture model to RTL to verification
- Experience leading architectural verification, silicon correlation, and performance validation across multidisciplinary engineering teams.
Desired Qualifications
- Demonstrated expertise in D2D, UCIe, or other short-reach die-to-die communication.
- Expertise in advanced packaging including silicon interposers, EMIB, hybrid bonding, and 3D integration.
- Management experience
Compensation and Benefits
The annual base salary range for this position is USD 167,500.00 To USD 268,000.00
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Source: Broadcom on Workday · View original posting (opens in new tab)
Pay in context
This role's base floor ($167,500) is above 79% of the 8,139 Engineering (non-software) roles nationwide listed on this site; 1 other lists the same floor. Their median floor is $136,000; the middle half runs from $116,800 to $160,000.
Only jobs on this site count, and each one publishes a base salary of $100,000 or more, so this compares six-figure jobs with each other, not with the whole market. Computed Nov 8, 2026.
This listingPrincipal Die-to-Die Interconnect Modeling Architect$167,500 to $268,000
Sr Engineering Manager – Private AI$167,500 to $268,000
R&D Engineer$167,500 to $268,000
Infrastructure AI/ML Engineer for Memory Design, Characterization, and Yield Optimization$150,800 to $241,200
Senior Manager, International Tax$146,900 to $235,000
R&D Engineer IC Design 5$143,800 to $230,000
DFT Lead Engineer$143,800 to $230,000
Chart as a table
| Role | Published base |
|---|---|
| Principal Die-to-Die Interconnect Modeling Architect (this listing) | $167,500 - $268,000 |
| Sr Engineering Manager – Private AI | $167,500 - $268,000 |
| R&D Engineer | $167,500 - $268,000 |
| Infrastructure AI/ML Engineer for Memory Design, Characterization, and Yield Optimization | $150,800 - $241,200 |
| Senior Manager, International Tax | $146,900 - $235,000 |
| R&D Engineer IC Design 5 | $143,800 - $230,000 |
| DFT Lead Engineer | $143,800 - $230,000 |
Observed changes
- First observed on the employer's board
- Began meeting the published-salary criteria
- Observed since
- Employer-stated posting date
- 2026-10-08
Where this pay comes from
Location as the employer wrote it: USA-CA San Jose Innovation Drive • USA-Colorado-Fort Collins-4380 Ziegler Road
The annual base salary range for this position is USD 167,500.00 To USD 268,000.00
- Method
- Employer text, read with fixed rules and re-verified
- Checked
- Rule set
- us-base-v2
The pay passage appears in the employer's own job text. Fixed, deterministic rules located it, and the passage below was checked against the stored copy of the posting.
What we verified
- The pay figures come from the employer's own listing, quoted exactly above.
- The pay is an annual base salary in US dollars with a minimum of at least $100,000.
- The role was publicly listed on the employer's job board when last checked.
We do not verify what the employer will actually offer, whether the employer is still recruiting for the role, or anything beyond what the employer published. Full methodology.
