Senior Staff Engineer, Product Marketing (AI datacenter infrastructure)
Company websiterenesas.com (Renesas Electronics, opens in new tab)
Base salary $180K to $223K
Employer-published annual base salary, USD. Advertised base range in United States
You apply on the employer's own site. Six Figure Work does not handle applications.
- LocationUnited States
- WorkplaceRemote
- Status at last checkSource accepting applications when checked
- Last checked (1 h ago) · observed since
About this job
Job Description
This senior role combines datacenter server-system expertise with product definition and marketing for MCU-based platform-management and control-plane solutions. The candidate will understand how server motherboards, CPU and GPU/AI accelerator trays, storage backplanes, power systems, and cooling subsystems are monitored and controlled. The focus is distributed management controllers, satellite controllers, and board-management MCUs that work alongside the baseboard management controller (BMC), rather than a replacement for the BMC itself. Working with hyperscalers, server OEMs, ODMs, and ecosystem partners, the candidate will translate system requirements into differentiated silicon, firmware, reference solutions, business cases, roadmaps, and go-to-market plans.
Qualifications
Bachelor’s degree or higher in electrical engineering, computer engineering, computer science, or related field with 8+ years of relevant experience.
Experience in system architecture, server platform management, embedded systems, semiconductor product definition, technical product management, or applications engineering.
Strong system knowledge of server motherboards, CPU/GPU/AI accelerator platforms, storage backplanes, and power and cooling subsystems, including their management interfaces and controller partitioning.
Strong understanding of BMC-based out-of-band management, satellite management controllers, MCU/RTOS firmware, and the boundary between local real-time control and system-level management.
Working knowledge of MCTP transport, PLDM-based monitoring/control and firmware update, SPDM authentication and measurement exchange, and how device management integrates with BMC-hosted Redfish services.
Familiarity with server sideband interfaces such as I2C/SMBus, I3C, SPI, UART, GPIO, and PMBus, and their implications for connectivity, latency, reliability, and MCU requirements.
Ability to create product requirements, business cases, roadmaps, and go-to-market plans.
Strong communication skills with executive, technical, customer, and cross-functional audiences.
- Preferred: Experience with hyperscaler or enterprise servers, GPU/AI accelerator trays, rack management, power shelves, fan controllers, or liquid-cooling management.
Practical exposure to OpenBMC integration, OCP DC-SCM/DC-SCI or modular server architectures, and interoperability testing of MCTP/PLDM/SPDM endpoints.
Experience defining secure, software-enabled controllers with secure boot, hardware root of trust, device identity, signed firmware updates, recovery, SDKs, and reference designs.
Experience with server bring-up, power sequencing, telemetry and fault diagnostics, firmware lifecycle management, or customer design-ins involving hyperscalers, OEMs/ODMs, and BMC ecosystem partners.
Advanced degree in engineering or business, or equivalent senior product strategy experience.
Product definition: Define MCU requirements for server platform management, satellite controllers, and distributed control across compute, accelerator, storage, power, and cooling subsystems.
Translate customer and market input into MRDs, business cases, roadmap proposals, and investment priorities.
Define use cases for rack-level monitoring and control, board housekeeping, power sequencing, reset control, sensor aggregation, telemetry, thermal management, power capping, fault reporting, and recovery.
Define the complete solution: silicon, embedded firmware, management-protocol stacks, SDKs, tools/GUIs, reference designs, and customer-specific tools and application layer.
Customer and market discovery: Lead technical discovery with hyperscaler platform teams, server OEMs/ODMs, BMC and firmware vendors, accelerator platform teams, and power and cooling partners.
Map server and rack management architectures, controller placement, sideband connectivity, firmware ownership, and requirements for availability, serviceability, security, and lifecycle management.
Assess competitors and alternatives; convert insights into differentiated positioning and roadmap choices.
Track relevant Open Compute Project (OCP) initiatives, including DC-SCM/DC-SCI, and DMTF management standards including MCTP, PLDM, SPDM, and Redfish; translate their implications into product and interoperability requirements.
Product marketing and go-to-market: Create positioning, messaging, launch plans, sales enablement, customer presentations, and competitive briefs.
Position Renesas MCUs as BMC companion and satellite-controller solutions for secure, interoperable platform management, with clear differentiation from general-purpose MCUs and BMC SoCs.
Connect product capabilities to customer use cases, ecosystem standards, reference designs, and business value.
Support design-in activity with sales, field applications, and customer engineering teams.
Align product line, architecture, silicon, software, applications, sales, and strategic customer teams.
Balance market opportunity, technical feasibility, development investment, and commercial return.
Lead reviews for product concepts, business cases, roadmap choices, launch readiness, and customer priorities.
Align silicon and firmware plans with customer platform schedules, BMC integration, protocol interoperability, reference-design validation, and deployment support.
Cross-functional execution: Align product line, architecture, silicon, software, applications, sales, and strategic customer teams.
Balance market opportunity, technical feasibility, development investment, and commercial return.
Lead reviews for product concepts, business cases, roadmap choices, launch readiness, and customer priorities.
Align silicon and firmware plans with customer platform schedules, BMC integration, protocol interoperability, reference-design validation, and deployment support.
Additional Information
Pay Transparency
The expected annual pay range for this position is $180,000 - $223,000. This position is also eligible for bonus opportunities. Please note that final offer amount will be dependent on geographic location, applicable experience, and skillset of the candidate.
Renesas offers a full range of elective benefits including medical, health savings account (with applicable medical plan), dental, vision, health and/or dependent care flexible spending accounts, pre-tax commuter benefits, life insurance, AD&D, and pet insurance. In addition to elective benefit options, benefited employees receive company-paid life insurance and AD&D, LTD, short term medical benefits as well as paid sick time, paid holidays, and accrued paid vacation. New employees will attend a detailed benefit orientation to learn more about our many benefits and resources.
Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
Are you ready to join our team and shape the future with us?
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.
Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.
Source: Renesas Electronics on SmartRecruiters · View original posting (opens in new tab)
Pay in context
This role's base floor ($180,000) is above 75% of the 2,589 Marketing roles nationwide listed on this site; 63 others list the same floor. Their median floor is $149,349; the middle half runs from $123,000 to $176,600.
Only jobs on this site count, and each one publishes a base salary of $100,000 or more, so this compares six-figure jobs with each other, not with the whole market. Computed Nov 8, 2026.
This listingSenior Staff Engineer, Product Marketing (AI datacenter infrastructure)$180K to $223K
Principal Power Architect (Product Definition)$180K to $225K
Total Rewards Director (Onsite)$185K to $220K
Principal Digital Design Engineer$190K to $240K
Principal Electrical Engineer$198K to $245K
Principal Package Design Engineer$200K to $240K
Principal HR Technology & AI Enablement Partner$200K to $250K
Chart as a table
| Role | Published base |
|---|---|
| Senior Staff Engineer, Product Marketing (AI datacenter infrastructure) (this listing) | $180K - $223K |
| Principal Power Architect (Product Definition) | $180K - $225K |
| Total Rewards Director (Onsite) | $185K - $220K |
| Principal Digital Design Engineer | $190K - $240K |
| Principal Electrical Engineer | $198K - $245K |
| Principal Package Design Engineer | $200K - $240K |
| Principal HR Technology & AI Enablement Partner | $200K - $250K |
Observed changes
- Began meeting the published-salary criteria
- First observed on the employer's board
- Observed since
- Employer-stated posting date
- 2026-11-03
Where this pay comes from
Location as the employer wrote it: San Jose, CALIFORNIA, United States (remote)
The expected annual pay range for this position is $180,000 - $223,000. This position is also eligible for bonus opportunities. Pl
- Method
- Employer text, read with fixed rules and re-verified
- Checked
- Rule set
- us-base-v2
The pay passage appears in the employer's own job text. Fixed, deterministic rules located it, and the passage below was checked against the stored copy of the posting.
What we verified
- The pay figures come from the employer's own listing, quoted exactly above.
- The pay is an annual base salary in US dollars with a minimum of at least $100,000.
- The role was publicly listed on the employer's job board when last checked.
We do not verify what the employer will actually offer, whether the employer is still recruiting for the role, or anything beyond what the employer published. Full methodology.
