Sr. Embedded Software Engineer
Company websiteflir.com (Teledyne FLIR, opens in new tab)
Base salary $113,600 to $151,400
Employer-published annual base salary, USD. Advertised base range in Goleta, CA
You apply on the employer's own site. Six Figure Work does not handle applications.
- LocationGoleta, CA
- WorkplaceWorkplace not stated
- Status at last checkSource accepting applications when checked
- Last checked (19 min ago) · observed since
About this job
Be visionary
Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.
We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.
Job Description
Job Summary:
Software design and development of embedded software for infrared and sensing systems. Participation in every phase of a project: requirements review, software design and coding, unit testing, system integration and sustaining engineering.
Job Qualifications:
- 10+ years of experience with embedded programming and board level software development in C (or equivalent)
- Experience with embedded RTOS (e.g. Green Hills uVelOSity, embedded Linux, RTEMs, etc.) and multi-threaded software development
- Expertise in developing multi-core embedded software is highly desirable
- Experience in developing on embedded SoCs is highly desirable
- Experience with multi-core imaging and vision processing platforms (such as NVIDIA or Qualcomm) is highly desirable but not required
- Ability to understand both the hardware and software components of the embedded systems under development
- Excellent knowledge of hardware subsystems and common peripheral buses I2C, SPI, USB
- Excellent verbal and written communication skills in English
- Experience designing, specifying and implementing low latency protocols and interfaces between peripherals and devices. Teledyne FLIR software operates under rigorous constraints related to latency and frame loss.
- Ability to setup various embedded tool chains, build and debugging environments and use of debugging tools like oscilloscopes, logic analyzers, etc.
- Experience with infrared technologies, image acquisition and processing are highly desired but not required
- Experience using AI tools in embedded software development workflows is valuable
Education
- BS or MS in Computer Science/Engineering, EE, Mathematics, Physics or related or equivalent relevant work experience.
Applicants must be a U.S. citizen.
Salary Range:
$113,600.00-$151,400.000The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.
Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.
Teledyne is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws.
Source: Teledyne FLIR on Workday · View original posting (opens in new tab)
Pay in context
This role's base floor ($113,600) is above 3% of the 4,296 Software Engineering roles in California listed on this site. Their median floor is $176,000; the middle half runs from $149,100 to $203,250.
Only jobs on this site count, and each one publishes a base salary of $100,000 or more, so this compares six-figure jobs with each other, not with the whole market. Computed Nov 7, 2026.
This listingSr. Embedded Software Engineer$113,600 to $151,400
SAP Finance Solution Architect$114,800 to $153,100
Environmental, Health and Safety Manager$114,800 to $153,100
Quality Assurance Manager$114,800 to $153,100
Wafer Fab Process Engineer$113,600 to $151,400
Firmware Engineer – FPGA & Imaging Systems$113,600 to $151,400
Senior RF Electrical Engineer$113,600 to $151,400
Chart as a table
| Role | Published base |
|---|---|
| Sr. Embedded Software Engineer (this listing) | $113,600 - $151,400 |
| SAP Finance Solution Architect | $114,800 - $153,100 |
| Environmental, Health and Safety Manager | $114,800 - $153,100 |
| Quality Assurance Manager | $114,800 - $153,100 |
| Wafer Fab Process Engineer | $113,600 - $151,400 |
| Firmware Engineer – FPGA & Imaging Systems | $113,600 - $151,400 |
| Senior RF Electrical Engineer | $113,600 - $151,400 |
Observed changes
- First observed on the employer's board
- Began meeting the published-salary criteria
- Observed since
- Employer-stated posting date
- 2026-08-28
Where this pay comes from
Location as the employer wrote it: US - Goleta, CA
$113,600.00-$151,400.000
- Method
- Employer text, read with fixed rules and re-verified
- Checked
- Rule set
- us-base-v2
The pay passage appears in the employer's own job text. Fixed, deterministic rules located it, and the passage below was checked against the stored copy of the posting.
What we verified
- The pay figures come from the employer's own listing, quoted exactly above.
- The pay is an annual base salary in US dollars with a minimum of at least $100,000.
- The role was publicly listed on the employer's job board when last checked.
We do not verify what the employer will actually offer, whether the employer is still recruiting for the role, or anything beyond what the employer published. Full methodology.