Six Figure Work

Wafer Fab Process Engineer

Teledyne FLIR

Company websiteflir.com (Teledyne FLIR, opens in new tab)

Base salary $113,600  to $151,400

Employer-published annual base salary, USD. Advertised base range in Goleta, CA

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  • LocationGoleta, CA
  • WorkplaceWorkplace not stated
  • Status at last checkSource accepting applications when checked
  • Last checked (24 min ago) · observed since

About this job

Be visionary

Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.​

We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

Job Description

About the job

We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

Job Summary:

As part of the uncooled detector (focal plane array) research and development team, the successful candidate will have responsibility for engineering wafer fab processes including plasma etch, thin film deposition, lithography, and wet cleans for next generation infrared detector designs. Candidate will design and implement new processes and automate or improve existing ones to support aggressive technology development goals. They will also own different tools and associated modules in the area. Candidate will characterize wafers and devices using SEM and or FIB/SEM. As part of process development, hands-on wafer fabrication and characterization of pilot lots is required. This is the right place for a self-directed, goal-oriented, collaborative engineer. The work is varied and challenging where creative problem-solving opportunities are many. Our culture is collaborative, supportive, and fun. The work environment is mixed general office and clean room/lab.

Primary Duties & Responsibilities:

  • Innovate new processes to enable the technology roadmap
  • Design and execute experiments, analyze data, draw conclusions, document, and communicate results
  • Own tools and process modules in the area
  • Establish feasibility of new processes through hands‑on processing of pilot lots on production equipment
  • Characterize results using quantitative metrology tools
  • Automate or improve established processes
  • Document methods and workflows in MES‑ready format
  • Plan for statistical process control (SPC) practices as appropriate
  • Evaluate production yield challenges and recommend improvements

​Job Qualifications:

  •   Bachelor's degree or equivalent experience in related technical discipline required
  • 0-5 years of related experience desired
  • Proficient computer skills – Word, Excel & Outlook
  •   Ability to communicate clearly in written and spoken English
  • Strong data analysis skills (fluency in Excel, MatLAB JMP, Python, SQL, or equivalent is helpful)
  • Ability to use inspection equipment (microscopes, FIB/SEM, interferometers), semiconductor fabrication equipment, and wet bench chemistry
  • Direct experience with one or more key wafer fabrication processes
  • Familiarity and/or strong desire to learn microelectronic/semiconductor and MEMS fabrication techniques
  • Applicants must be either a U.S. citizen or Perm Resident

Desired Background

  • Wafer processing tools for semiconductor or MEMS fabrication
  • Infrared detector technology
  • Statistical Process Control and Design of Experiments familiarity desired
  • Lean Six Sigma or other problem solving/decision making methods (8D, Kepner-Tregoe, or equivalent)

What We Offer

  • Competitive Salary & Benefits Package
  • Health, Dental, Vision, and Life Insurance starting Day 1
  • Paid Vacation, Sick Time, and Holidays
  • 401(k) with Company Match
  • Employee Stock Purchase Plan
  • Tuition Reimbursement for Education
  • Fun Employee Events throughout the year

Salary Range:

$113,600.00-$151,400.000

The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.

Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.

Teledyne is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws. ​

Source: Teledyne FLIR on Workday · View original posting (opens in new tab)

Pay in context

This role's base floor ($113,600) is above 13% of the 2,090 Engineering (non-software) roles in California listed on this site; 1 other lists the same floor. Their median floor is $146,900; the middle half runs from $125,000 to $174,750.

Only jobs on this site count, and each one publishes a base salary of $100,000 or more, so this compares six-figure jobs with each other, not with the whole market. Computed Nov 7, 2026.

This range next to 6 other live Teledyne FLIR roles with the nearest advertised base floor
Chart as a table
This range next to 6 other live Teledyne FLIR roles with the nearest advertised base floor
RolePublished base
Wafer Fab Process Engineer (this listing)$113,600 - $151,400
SAP Finance Solution Architect$114,800 - $153,100
Environmental, Health and Safety Manager$114,800 - $153,100
Quality Assurance Manager$114,800 - $153,100
Sr. Embedded Software Engineer$113,600 - $151,400
Firmware Engineer – FPGA & Imaging Systems$113,600 - $151,400
Senior RF Electrical Engineer$113,600 - $151,400

Same $100K to $400K scale as every card. All Teledyne FLIR roles · How to read the bar

Observed changes

  1. First observed on the employer's board
  2. Began meeting the published-salary criteria
Observed since
Employer-stated posting date
2026-11-02
Where this pay comes from

Location as the employer wrote it: US - Goleta, CA

$113,600.00-$151,400.000

Method
Employer text, read with fixed rules and re-verified
Checked
Rule set
us-base-v2

The pay passage appears in the employer's own job text. Fixed, deterministic rules located it, and the passage below was checked against the stored copy of the posting.

What we verified

  • The pay figures come from the employer's own listing, quoted exactly above.
  • The pay is an annual base salary in US dollars with a minimum of at least $100,000.
  • The role was publicly listed on the employer's job board when last checked.

We do not verify what the employer will actually offer, whether the employer is still recruiting for the role, or anything beyond what the employer published. Full methodology.