Six Figure Work

Wafer Fab Equipment Engineer

Teledyne FLIR

Company websiteflir.com (Teledyne FLIR, opens in new tab)

Base salary $113,600  to $151,400

Employer-published annual base salary, USD. Advertised base range in Goleta, CA

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  • LocationGoleta, CA
  • WorkplaceWorkplace not stated
  • Status at last checkSource accepting applications when checked
  • Last checked (1 h ago) · observed since

About this job

Be visionary

Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.​

We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

Job Description

Job Summary:

As part of the Uncooled Detector (Focal Plane Array) Low-Rate Production team, the Wafer Fab Equipment Engineer will be responsible for the ownership, reliability, and continuous improvement of wafer fabrication equipment supporting low‑rate manufacturing of infrared detector devices. The role focuses on improving OEE (Overall Equipment Effectiveness) for equipment used in plasma etch, thin film deposition, lithography, and wet processing, while ensuring tools are safe, available, capable, and production‑ready. The Equipment Engineer will be a liaison between process and maintenance providing hands‑on technical support for low-rate production activity; troubleshoot complex equipment issues; optimize preventive maintenance strategies; support the qualification, sustainment, and recovery of critical tools and modules; and own data analysis and trends for optimum equipment health. This role works closely with Process Engineering, Maintenance, and Quality teams to ensure stable execution of production commitments.

This is an ideal position for a self‑directed, technically strong, and collaborative engineer who enjoys hands‑on equipment work, root‑cause problem solving, and operating in a structured cleanroom production environment. The work environment is a mix of office and cleanroom settings, within a collaborative, supportive, and engaging team culture.

Primary Duties & Responsibilities:

  • Own and support assigned wafer fabrication tools and associated subsystems used in low-rate production
  • Troubleshoot, diagnose, and resolve equipment issues impacting safety, yield, schedule, or throughput
  • Drive equipment reliability improvements through root cause analysis and corrective/preventive actions
  • Partner with Process Engineers to ensure tools meet process capability and control requirements
  • Support hands‑on wafer processing and recovery activities for production lots as needed
  • Collect, analyze, and trend equipment performance metrics (OEE, Uptime, MTBF, MTTR, repeat failures)
  • Improve equipment diagnostics, automation, and recovery procedures to reduce unplanned downtime
  • Document equipment procedures, configurations, and workflows in MES‑ready formats
  • Ensure compliance with safety, cleanroom, and EHS requirements
  • Collaborate with Process, Maintenance, Quality, and R&D teams to support stable low-rate production execution

Job Qualifications:

  • Minimum Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or a related technical discipline
  • 1–5 years of relevant experience supporting semiconductor, MEMS, or microfabrication equipment
  • Familiarity with equipment metrics (MTBF, MTTR, OEE), SPC concepts, or structured escalation workflows
  • Strong written and verbal communication skills in English
  • Proficient computer skills, including JMP, Microsoft Word, Excel
  • Strong troubleshooting, root‑cause analysis, and problem‑solving skills
  • Ability to work hands‑on with semiconductor fabrication equipment, including vacuum systems, RF plasma systems, motion control, and wet processing tools
  • Experience with one or more key wafer fabrication processes
  • Experience using basic inspection and diagnostic tools (e.g., microscopes, electrical test equipment; SEM/FIB exposure a plus)
  • Familiarity with cleanroom operations, safety practices, and controlled manufacturing environments
  • Must be a U.S. Citizen or Permanent Resident

Desired Background

  • Exposure to infrared detectors, focal plane array, or imaging device fabrication
  • Experience developing and executing preventive maintenance strategies

Lean Six Sigma or other problem solving/decision making methods (8D, Kepner-Tregoe, or equivalent)

Salary Range:

$113,600.00-$151,400.000

The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.

Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.

Teledyne is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws. ​

Source: Teledyne FLIR on Workday · View original posting (opens in new tab)

Pay in context

This role's base floor ($113,600) is above 12% of the 604 Manufacturing & Production roles in California listed on this site. Their median floor is $147,000; the middle half runs from $128,750 to $165,000.

Only jobs on this site count, and each one publishes a base salary of $100,000 or more, so this compares six-figure jobs with each other, not with the whole market. Computed Nov 7, 2026.

This range next to 6 other live Teledyne FLIR roles with the nearest advertised base floor
Chart as a table
This range next to 6 other live Teledyne FLIR roles with the nearest advertised base floor
RolePublished base
Wafer Fab Equipment Engineer (this listing)$113,600 - $151,400
SAP Finance Solution Architect$114,800 - $153,100
Environmental, Health and Safety Manager$114,800 - $153,100
Quality Assurance Manager$114,800 - $153,100
Wafer Fab Process Engineer$113,600 - $151,400
Sr. Embedded Software Engineer$113,600 - $151,400
Firmware Engineer – FPGA & Imaging Systems$113,600 - $151,400

Same $100K to $400K scale as every card. All Teledyne FLIR roles · How to read the bar

Observed changes

  1. First observed on the employer's board
  2. Began meeting the published-salary criteria
Observed since
Employer-stated posting date
2026-08-19
Where this pay comes from

Location as the employer wrote it: US - Goleta, CA

$113,600.00-$151,400.000

Method
Employer text, read with fixed rules and re-verified
Checked
Rule set
us-base-v2

The pay passage appears in the employer's own job text. Fixed, deterministic rules located it, and the passage below was checked against the stored copy of the posting.

What we verified

  • The pay figures come from the employer's own listing, quoted exactly above.
  • The pay is an annual base salary in US dollars with a minimum of at least $100,000.
  • The role was publicly listed on the employer's job board when last checked.

We do not verify what the employer will actually offer, whether the employer is still recruiting for the role, or anything beyond what the employer published. Full methodology.

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