Yield Engineer

Be visionary

Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.​

We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

Job Description

Job Summary

Want to use data and hands-on engineering to solve complex semiconductor manufacturing challenges?

Join our Detector Yield and Integration Engineering team as a Yield Engineer, where you’ll play a key role in improving product yield, performance, reliability, and manufacturing efficiency across advanced technology production lines.

You’ll work with wafer and die-level data, semiconductor processes, metrology, and failure analysis techniques to identify yield opportunities, uncover root causes, and drive meaningful improvements. This role combines data analytics, semiconductor processing, failure analysis, and hands-on problem solving, giving you the opportunity to see the direct impact of your work on product performance and manufacturing results.

You’ll collaborate across Process Engineering, Design, Manufacturing, Quality, and other technical teams to turn complex data and failure mechanisms into actionable engineering solutions.

What You’ll Do

• Monitor and analyze wafer and die yield performance using SPC, MES, and other manufacturing data systems.
• Analyze electrical test data, defect density, process trends, and metrology data to identify opportunities for yield improvement.
• Use tools such as JMP, Python, MATLAB, SQL, or similar platforms to analyze and visualize manufacturing and test data.
• Develop yield dashboards, reports, and engineering analyses that turn complex data into actionable insights.
• Lead and support device failure analysis to identify root causes of defects and performance issues.
• Apply structured problem-solving methodologies such as Kepner-Tregoe, DMAIC, 8D, and Six Sigma.
• Design and analyze experiments using DOE and ANOVA to improve processes and product performance.
• Utilize failure analysis and metrology techniques including optical microscopy, SEM, FIB, EDX, profilometry, ellipsometry, and elemental analysis.
• Apply fault isolation techniques to understand device and process-related failures.
• Partner with Process, Design, Manufacturing, Quality, and Operations teams to implement corrective actions and yield improvements.
• Support continuous improvement efforts that enhance product performance, reliability, and manufacturing efficiency.

Technologies & Areas You May Work With

• Semiconductor wafer processing
• Photolithography, etch, deposition, surface cleaning, CMP, and inspection
• SPC and MES systems
• JMP, Python, MATLAB, and SQL
• DOE and ANOVA
• SEM, FIB, and EDX
• Optical microscopy
• Profilometry and ellipsometry
• Failure analysis and fault isolation
• Vacuum technology
• Infrared imaging
• Hermetic packaging

Qualifications

• Bachelor’s degree in Engineering, Physics, Materials Science, Chemistry, or another related science or technical discipline. Master’s degree preferred.
• Relevant professional experience may be considered in lieu of education.
• 2+ years of experience in Process, Manufacturing, Quality, Yield, Design Engineering, or a related technical engineering discipline.
• Experience with data analysis, statistical methods, and structured problem solving.
• Strong analytical and troubleshooting skills with the ability to translate data into actionable engineering solutions.
• Ability to work collaboratively across engineering and manufacturing teams.
• Strong written and verbal communication skills.
• Must be a U.S. citizen or lawful permanent resident.

Preferred Experience

Experience in one or more of the following areas is a plus. You do not need experience in every area to be considered.

• Semiconductor wafer fabrication or processing
• Yield engineering or yield improvement
• Device or semiconductor failure analysis
• SPC and manufacturing data analysis
• JMP, Python, MATLAB, or SQL
• DOE and statistical analysis
• SEM, FIB, EDX, or other advanced characterization techniques
• Infrared imaging technology
• Vacuum systems
• Hermetic packaging

What We Offer

• Competitive salary and benefits package
• Health, dental, vision, and life insurance from Day 1
• Paid vacation, sick time, and holidays
• 401(k) with company match
• Employee Stock Purchase Plan
• Educational tuition reimbursement
• Career growth and development opportunities
• Collaborative, team-focused environment
• Fun employee events throughout the year

Why Join Us?

This is an opportunity to work at the intersection of semiconductor technology, data science, failure analysis, and advanced imaging. You’ll investigate real manufacturing and device challenges, identify why problems occur, and help implement solutions that directly improve product yield, performance, and reliability.

If you enjoy digging into data, solving technical mysteries, and seeing your engineering work translate into measurable manufacturing improvements, we’d love to hear from you

Salary Range:

$113,600.00-$151,400.000

The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.

Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.

Teledyne is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws. ​